AlN(Aluminum Nitride) Ceramic has excellent thermal conductivity, is thus considered as high performance electronic packaging material. UNIPRETEC offers a series of substrates based on AlN materials for use in application environments. These materials are available in both lapped and "as fired" condition as well as metalized and non-metalized substrates.
Properties of Aluminum Nitride(AlN) Ceramic :
Excellent in insulation properties
|
Small dielectric constant
|
Excellent in thermal shock resistance
|
Good smoothness / flatness
|
High thermal conductivity
|
Thermal expansion coefficient similar to silicon
|
Excellent resistance against oil / acid / alkali
|
...
|
Typical Applications of Aluminum Nitride(AlN) Ceramic :
LED packages
|
Power modules
|
Wafer bonding
|
Heat dissipation substrate
|
Substrate for chip resistors
|
HIC substrate/plate for heat dissipation
|
FAX substrates for thermal printer head
|
...
|
Material Thermal Conductivity Performance Comparison Table :

Material Coeffecient of Expansion Performance Comparison Table :
