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High Thermal Conductivity AlN Aluminum Nitride Ceramic Substrate

High thermal conductivity and excellent electrical insulation are the two main properties of AlN Ceramic. Aluminum Nitride substrates are typically used in heat dissipation substrate, LED package, power module, wafer bonding, power resistor...
  • Material

    : Aluminum Nitride
  • Color

    : Light Grey
  • Density

    : 3.3 g/cm3
  • Thermal Conductivity

    : > 170 W/m.K
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Product Detail

High Thermal Conductivity AlN Aluminum Nitride Ceramic Substrate/Sheet/Plate


aluminum nitride substrate


High thermal conductivity and excellent electrical insulation are the two main properties of Aluminum Nitride ceramic. AlN substrates are typically used in heat dissipation substrate, LED package, power module, wafer bonding, power resistor... UNIPRETEC's standard Aluminum Nitride Ceramic Substrates are in thickness 0.385mm, 0.5mm, 0.635mm, 0.8mm and 1.0mm, customized specifications are also available. We are also good at laser scribing, surface grinding, polishing and other machining work. Some advantages of Aluminum Nitride Ceramic Substrates are:



Materials' Properties of AlN Aluminum Nitride Ceramic Substrate/Sheet/Plate



Manufacturing Processes of AlN Aluminum Nitride Ceramic Substrate/Sheet/Plate



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