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Technical Ceramics

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High Thermal Conductivity AlN Aluminum Nitride Ceramic Substrate

High thermal conductivity and excellent electrical insulation are the two main properties of AlN Ceramic. Aluminum Nitride substrates are typically used in heat dissipation substrate, LED package, power module, wafer bonding, power resistor...
  • Material

    : Aluminum Nitride
  • Color

    : Light Grey
  • Density

    : 3.3 g/cm3
  • Thermal Conductivity

    : > 180 W/m.K
  • Max. Service Temperature

    : > 1,200 degree C
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Product Detail

▼ Material Description

When it comes to providing good thermal conductivity and high electrical insulation features, aluminum nitride substrate is a superb option because of its efficacy. Aluminum nitride sheets are widely used in the semiconductor application industry instead of beryllium oxide (BeO) since aluminium nitride is non-toxic and does not produce dangerous vapors when grinded and machined. Aluminum nitride ceramic substrate has a thermal expansion and isolation coefficient which closely matches the silicon wafer product, making it useful in applications in electronics that often have high temperatures and heat dissipation problems.


▼ Features and Properties

 √ Small Dielectric Constant
 √ Good Mechanical Strength 
 √ High Thermal Conductivity
 √ Good Smoothness / Flatness 
 √ Excellent in Electrical Insulation
 √ Excellent in Thermal Shock Resistance
 √ Thermal Expansion Coefficient Similar to Silicon
 √ Excellent Resistance against Oil, Acid and Alkali 


 ITEM
 UNIT
 ALN
 Main Content
 -  AlN > 95% 
 Density
 g/cm3
 > 3.3
 Color
 -  Grey
 Water Absorption
 %
 0
 Warpage
 -  < 2‰
 Standard Surface Roughness (Ra)
 um
 0.3 - 0.6
 Flexural Strength
 Mpa
 440
 Thermal Conductivity (25 °C)
 W/m.K
 > 175
 Thermal Expansion Coefficient (25 - 300 °C)
 10-6 mm/°C
 2 - 3
 Thermal Expansion Coefficient (300 - 800 °C)
 10-6 mm/°C
 2.5 - 3.5
 Max. Working Temperature
 °C / °F
 1,200 / 2,190
 Dielectric Strength
 KV/mm
 > 17
 Dielectric Constant
 1 MHz                               
 17                               
 Electrical Resistivity (25 °C)
 Ω·cm
 > 1014

∆ The data is offered for reference only, exact data will vary depending on producing method and part configuration.


▼ Properties Comparison : Thermal Conductivity



▼ Properties Comparison : Coeffecient of Thermal Expansion


▼ Standard Dimensions and Tolerance

 Length and Width
 Thickness
 Tolerance (Thickness)
 110mm x 110mm (4.3" x 4.3")
 0.25mm (0.010")
 ±0.03mm(<1.0mm)
 114mm x 114mm (4.5" x 4.5")
 0.38mm (0.015")
 ±0.05mm(1.0mm - 1.5mm)
 120mm x 120mm (4.7" x 4.7")
 0.50mm (0.020")
 ±0.07mm(>1.5mm)
 127mm x 127mm (5.0" x 5.0")
 0.63mm (0.250")
 ±0.10mm(>2.0mm)
 130mm x 140mm (5.1" x 5.5")
 0.76mm (0.030")

 109mm x 130mm (4.3" x 5.1")
 1.00mm (0.390")
 Tolerance (Length and Width)
 190mm x 140mm (7.5" x 5.5")
 2.00mm (0.790")                 
 +0.25mm/-0.05mm
∆ Customized dimensions are available. Laser cutting service can be provided and make customized shapes and holes. 


▼ Surface Roughness of AlN Substrates

All substrates are grinded with surface roughness Ra0.3-0.6. We can also do surface polishing, one-side polishing or double-side polishing with surface roughness Ra0.02-0.05.



▼ Applications of Aln Ceramic Substrates

 ● LED Packages
 ● Power Modules
 ● Wafer Bonding
 ● Heat Dissipation Substrate
 ● Substrate for Chip Resistors
 ● HIC Substrate/Plate for Heat Dissipation
 ● FAX Substrates for Thermal Printer Head
 ● ...More



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