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Technical Ceramics

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AlN Aluminum Nitride Ceramic Sheet Plate Substrate

AlN has excellent electrical insulation and high thermal conductivity, is thus considered as high performance electronic packaging material. UNIPRETEC offers a series of substrates based on AlN materials for use in application environments.
  • Material

    : Aluminum Nitride
  • Color

    : Grey
  • Density

    : 3.30 g/cm3
  • Thermal Conductivity

    : > 170 W/m.K
  • Max. Service Temperature

    : 1200 degree C
  • Typical Advantages

    : High Thermal Conductivity
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Product Detail

AlN(Aluminum Nitride) Ceramic has excellent thermal conductivity, is thus considered as high performance electronic packaging material. UNIPRETEC offers a series of substrates based on AlN materials for use in application environments. These materials are available in both lapped and "as fired" condition as well as metalized and non-metalized substrates.


Properties of Aluminum Nitride(AlN) Ceramic :


   Excellent in insulation properties
   Small dielectric constant
   Excellent in thermal shock resistance
   Good smoothness / flatness
   High thermal conductivity    Thermal expansion coefficient similar to silicon
   Excellent resistance against oil  /  acid /  alkali
   ...


Typical Applications of Aluminum Nitride(AlN) Ceramic :


   LED packages    Power modules
   Wafer bonding    Heat dissipation substrate
   Substrate for chip resistors    HIC substrate/plate for heat dissipation
   FAX substrates for thermal printer head    ...


Material Thermal Conductivity Performance Comparison Table :




Material Coeffecient of Expansion Performance Comparison Table :



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