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AlN and Al2O3 Ceramic Substrates


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AlN and Al2O3 Ceramic Substrates AlN and Al2O3 Ceramic Substrates AlN and Al2O3 Ceramic Substrates AlN and Al2O3 Ceramic Substrates AlN and Al2O3 Ceramic Substrates AlN and Al2O3 Ceramic Substrates

AlN and Al2O3 Ceramic Substrates

The ceramic materials for substrates are characterized by their extremely high strength, excellent electrical insulation and thermal conductivity. The outstanding surface quality on both sides makes it the perfect companion for any commercial thick film paste and even makes them suitable for a number of thin film applications (sputtering).

  • Material

    : Al2O3 & AlN

  • Color

    : Grey & White

  • Density

    : 3.30-3.70 g/cm3

  • Max. Service Temperature

    : 1,200 ℃
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Product Detail

▼ Description of Ceramic Substrates

Currently, there are four main types of substrate materials commonly used in electronic packaging: polymer substrate; metal substrate; composite substrate; ceramic substrates. The ceramic substrate material is widely used in electronic packaging substrate for its following advantages (see below table). UNIPRETEC is good at providing ceramic substrates made of two main technical ceramics: 96% Alumina Ceramic and Aluminum Nitride Ceramic. The ceramic substrates can be etched various graphics like the PCB, with great current carrying capacity. It is suitable for products with high heat generation (high-brightness LED, solar energy), and its excellent weather resistance is more suitable for harsh outdoor environments.


  High Mechanical Strength
   Good Thermal Conductivity
  Excellent Electrical Insulation
   Outstanding Chemical Stability
  Extremely High Service Temperature
   Small Thermal Expansion Coefficient




▼ Properties of Ceramic Insulator Substrates

 ITEM
  UNIT
  A960
  ALN
 Main Content
  -  Al2O3 > 96%  
  AlN > 95%     
 Density
  g/cm3
  > 3.7
  > 3.3
 Color
  -  White
  Grey
 Water Absorption
  %
  0  0
 Warpage
  -  < 2‰
  < 2‰
 Standard Surface Roughness (Ra)
  um
  0.2 - 0.7
  0.3 - 0.6
 Flexural Strength
  Mpa
  380  440
 Thermal Conductivity (25 °C)
  W/m.K
  > 25
  > 175
 Thermal Expansion Coefficient  (25 - 300 °C)
  10-6 mm/°C 
  6.5 - 7.5
  2 - 3
 Thermal Expansion Coefficient (300 - 800 °C)
  10-6 mm/°C
  6.5 - 8.0
  2.5 - 3.5
 Max. Working Temperature
  °C
  1,200
  1,200
 Dielectric Strength
  KV/mm
  > 17
  > 17
 Dielectric Constant
  1 MHz
  9 - 10
  17
 Electrical Resistivity (25 °C)
  Ω·cm
  > 1014
  > 1014

∆ The data is offered for reference only, exact data will vary depending on producing method & part configuration.


▼ Standard Dimensions and Tolerance

 Length and Width
  Thickness
  Tolerance (Thickness)
 110mm x 110mm (4.3" x 4.3")
  0.25mm (0.010")
  ±0.03mm(<1.0mm)
 114mm x 114mm (4.5" x 4.5")
  0.38mm (0.015")
  ±0.05mm(1.0mm - 1.5mm)
 120mm x 120mm (4.7" x 4.7")
  0.50mm (0.020")
  ±0.07mm(>1.5mm)
 127mm x 127mm (5.0" x 5.0")
  0.63mm (0.250")
  ±0.10mm(>2.0mm)
 130mm x 140mm (5.1" x 5.5")
  0.76mm (0.030")
 109mm x 130mm (4.3" x 5.1")
  1.00mm (0.390")
  Tolerance (Length and Width)
 190mm x 140mm (7.5" x 5.5")
  2.00mm (0.790")                 
 +0.25mm/-0.05mm
∆ Customized dimensions are available. Laser cutting service can be provided and make customized shapes and holes. 


▼ Surface Roughness of Ceramic Substrates

All substrates are grinded with surface roughness Ra0.3-0.6. We can also do surface polishing, one-side polishing or double-side polishing with surface roughness Ra0.02-0.05.



▼ Applications of Ceramic Insulating Substrates

 ● LED Packages
  ● Power Modules
 ● Wafer Bonding
  ● Heat Dissipation Substrate
 ● Substrate for Chip Resistors
  ● HIC Substrate/Plate for Heat Dissipation
 ● FAX Substrates for Thermal Printer Head
  ● ...More


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AlN and Al2O3 Ceramic Substrates
The ceramic materials for substrates are characterized by their extremely high strength, excellent electrical insulation and thermal conductivity. The outstanding surface quality on both sides makes it the perfect companion for any commercial thick film paste and even makes them suitable for a number of thin film applications (sputtering).
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Customer ERAMET
Customer INDO-MIM
CORNING
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Partner Knowles Electronics
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MARTOR
PARTNER FUZHOU UNIVERSITY
PARTNER TSINGHUA UNIVERSITY
UNIPRETEC is founded in 2011 and located in Xiamen, China. We produce customized components as well as a comprehensive standard range of high-performance ceramics. Our products made of Aluminum Oxide (Al2O3) and Zirconium Oxide (ZrO2), as well as Boron Nitride (BN) and Silicon Nitride (Si3N4) are mainly used in the areas: Electrical Engineering, Mechanical Engineering and High Temperature Technology.
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