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AlN Aluminum Nitride Ceramic Substrates Sheets Plates


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AlN Aluminum Nitride Ceramic Substrates Sheets Plates AlN Aluminum Nitride Ceramic Substrates Sheets Plates AlN Aluminum Nitride Ceramic Substrates Sheets Plates AlN Aluminum Nitride Ceramic Substrates Sheets Plates

AlN Aluminum Nitride Ceramic Substrates Sheets Plates

Aluminum Nitride (AlN) has excellent electrical insulation and high thermal conductivity, is thus considered as high performance electronic packaging material. UNIPRETEC offers a series of substrates based on AlN materials for use in various application environments.

  • Material

    : AlN Ceramic

  • Color

    : Grey

  • Density

    : 3.30 g/cm3

  • Thermal Conductivity

    : > 180 W/m.K

  • Max. Service Temperature

    : 1,200 degree C

  • Typical Advantages

    : High Thermal Conductivity
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Product Detail

▼ Material Description of AlN Substrates

When it comes to providing good thermal conductivity and high electrical insulation features, aluminum nitride substrate is a superb option because of its efficacy. Aluminum nitride sheets are widely used in the semiconductor application industry instead of beryllium oxide (BeO) since aluminium nitride is non-toxic and does not produce dangerous vapors when grinded and machined. Aluminum nitride ceramic substrate has a thermal expansion and isolation coefficient which closely matches the silicon wafer product, making it useful in applications in electronics that often have high temperatures and heat dissipation problems.


▼ Features and Properties of AlN Plates

 √ Small Dielectric Constant
  √ Good Mechanical Strength
 √ High Thermal Conductivity
  √ Good Smoothness / Flatness
 √ Excellent in Electrical Insulation
  √ Excellent in Thermal Shock Resistance
 √ Thermal Expansion Coefficient Similar to Silicon
  √ Excellent Resistance against Oil, Acid and Alkali 


 ITEM
  UNIT
  ALN
 Main Content
  -  AlN > 95% 
 Density
  g/cm3
  > 3.3
 Color
  -  Grey
 Water Absorption
  %
  0
 Warpage
  -  < 2‰
 Standard Surface Roughness (Ra)
  um
  0.3 - 0.6
 Flexural Strength
  Mpa
  440
 Thermal Conductivity (25 °C)
  W/m.K
  > 175
 Thermal Expansion Coefficient (25 - 300 °C)
  10-6 mm/°C
  2 - 3
 Thermal Expansion Coefficient (300 - 800 °C)
  10-6 mm/°C
  2.5 - 3.5
 Max. Working Temperature
  °C / °F
  1,200 / 2,190
 Dielectric Strength
  KV/mm
  > 17
 Dielectric Constant
  1 MHz                               
  17                               
 Electrical Resistivity (25 °C)
  Ω·cm
  > 1014

∆ The data is offered for reference only, exact data will vary depending on producing method and part configuration.


▼ Properties Comparison : Thermal Conductivity



▼ Properties Comparison : Coeffecient of Thermal Expansion


▼ Standard Dimensions and Tolerance

 Length and Width
  Thickness
  Tolerance (Thickness)
 110mm x 110mm (4.3" x 4.3")
  0.25mm (0.010")
  ±0.03mm(<1.0mm)
 114mm x 114mm (4.5" x 4.5")
  0.38mm (0.015")
  ±0.05mm(1.0mm - 1.5mm)
 120mm x 120mm (4.7" x 4.7")
  0.50mm (0.020")
  ±0.07mm(>1.5mm)
 127mm x 127mm (5.0" x 5.0")
  0.63mm (0.250")
  ±0.10mm(>2.0mm)
 130mm x 140mm (5.1" x 5.5")
  0.76mm (0.030")
 109mm x 130mm (4.3" x 5.1")
  1.00mm (0.390")
  Tolerance (Length and Width)
 190mm x 140mm (7.5" x 5.5")
  2.00mm (0.790")                 
 +0.25mm/-0.05mm
∆ Customized dimensions are available. Laser cutting service can be provided and make customized shapes and holes. 


▼ Surface Roughness of AlN Ceramic Substrates

All substrates are grinded with surface roughness Ra0.3-0.6. We can also do surface polishing, one-side polishing or double-side polishing with surface roughness Ra0.02-0.05.



▼ Applications of Aluminum Nitride Substrates

 ● LED Packages
  ● Power Modules
 ● Wafer Bonding
  ● Heat Dissipation Substrate
 ● Substrate for Chip Resistors
  ● HIC Substrate/Plate for Heat Dissipation
 ● FAX Substrates for Thermal Printer Head
  ● ...More


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UNIPRETEC is founded in 2011 and located in Xiamen, China. We produce customized components as well as a comprehensive standard range of high-performance ceramics. Our products made of Aluminum Oxide (Al2O3) and Zirconium Oxide (ZrO2), as well as Boron Nitride (BN) and Silicon Nitride (Si3N4) are mainly used in the areas: Electrical Engineering, Mechanical Engineering and High Temperature Technology.
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