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AlN Aluminum Nitride Ceramic Substrates Sheets Plates

Aluminum Nitride (AlN) has excellent electrical insulation and high thermal conductivity, is thus considered as high performance electronic packaging material. UNIPRETEC offers a series of substrates based on AlN materials for use in various application environments.
  • Material

    : AlN Ceramic
  • Color

    : Grey
  • Density

    : 3.30 g/cm3
  • Thermal Conductivity

    : > 180 W/m.K
  • Max. Service Temperature

    : 1,200 degree C
  • Typical Advantages

    : High Thermal Conductivity
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Product Detail

▼ Material Description of AlN Substrates

When it comes to providing good thermal conductivity and high electrical insulation features, aluminum nitride substrate is a superb option because of its efficacy. Aluminum nitride sheets are widely used in the semiconductor application industry instead of beryllium oxide (BeO) since aluminium nitride is non-toxic and does not produce dangerous vapors when grinded and machined. Aluminum nitride ceramic substrate has a thermal expansion and isolation coefficient which closely matches the silicon wafer product, making it useful in applications in electronics that often have high temperatures and heat dissipation problems.


▼ Features and Properties of AlN Plates

 √ Small Dielectric Constant
 √ Good Mechanical Strength
 √ High Thermal Conductivity
 √ Good Smoothness / Flatness
 √ Excellent in Electrical Insulation
 √ Excellent in Thermal Shock Resistance
 √ Thermal Expansion Coefficient Similar to Silicon
 √ Excellent Resistance against Oil, Acid and Alkali 


 ITEM
 UNIT
 ALN
 Main Content
 -  AlN > 95% 
 Density
 g/cm3
 > 3.3
 Color
 -  Grey
 Water Absorption
 %
 0
 Warpage
 -  < 2‰
 Standard Surface Roughness (Ra)
 um
 0.3 - 0.6
 Flexural Strength
 Mpa
 440
 Thermal Conductivity (25 °C)
 W/m.K
 > 175
 Thermal Expansion Coefficient (25 - 300 °C)
 10-6 mm/°C
 2 - 3
 Thermal Expansion Coefficient (300 - 800 °C)
 10-6 mm/°C
 2.5 - 3.5
 Max. Working Temperature
 °C / °F
 1,200 / 2,190
 Dielectric Strength
 KV/mm
 > 17
 Dielectric Constant
 1 MHz                               
 17                               
 Electrical Resistivity (25 °C)
 Ω·cm
 > 1014

∆ The data is offered for reference only, exact data will vary depending on producing method and part configuration.


▼ Properties Comparison : Thermal Conductivity



▼ Properties Comparison : Coeffecient of Thermal Expansion


▼ Standard Dimensions and Tolerance

 Length and Width
 Thickness
 Tolerance (Thickness)
 110mm x 110mm (4.3" x 4.3")
 0.25mm (0.010")
 ±0.03mm(<1.0mm)
 114mm x 114mm (4.5" x 4.5")
 0.38mm (0.015")
 ±0.05mm(1.0mm - 1.5mm)
 120mm x 120mm (4.7" x 4.7")
 0.50mm (0.020")
 ±0.07mm(>1.5mm)
 127mm x 127mm (5.0" x 5.0")
 0.63mm (0.250")
 ±0.10mm(>2.0mm)
 130mm x 140mm (5.1" x 5.5")
 0.76mm (0.030")

 109mm x 130mm (4.3" x 5.1")
 1.00mm (0.390")
 Tolerance (Length and Width)
 190mm x 140mm (7.5" x 5.5")
 2.00mm (0.790")                 
 +0.25mm/-0.05mm
∆ Customized dimensions are available. Laser cutting service can be provided and make customized shapes and holes. 


▼ Surface Roughness of AlN Ceramic Substrates

All substrates are grinded with surface roughness Ra0.3-0.6. We can also do surface polishing, one-side polishing or double-side polishing with surface roughness Ra0.02-0.05.



▼ Applications of Aluminum Nitride Substrates

 ● LED Packages
 ● Power Modules
 ● Wafer Bonding
 ● Heat Dissipation Substrate
 ● Substrate for Chip Resistors
 ● HIC Substrate/Plate for Heat Dissipation
 ● FAX Substrates for Thermal Printer Head
 ● ...More


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