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Technical Ceramics

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AlN Aluminum Nitride Ceramic Substrate Metalized PCB

DPCs consist of a ceramic substrate such as Al2O3 (aluminium oxide) and AlN (Aluminum Nitride) serving as an insulating layer, and copper connections to ensure the electrical conductivity at high temperatures. For optimal reliability and performance, the module must demonstrate good properties in relation to heat dissipation to the heat sink and endurance against thermal cycling and power cycling.
  • Material

    Al2O3 / AlN
  • Density

    3.30-3.70 g/cm3
  • Color

    white / grey
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Product Detail

● Description of Ceramic Substrates DPC

Direct Plated Copper (DPC) is the newest development in the field of Ceramic Substrate PCBs and using this method can result in copper thickness' ranging from 10um (≈ 1/3oz) to 140um (4oz). With DPC track printing and etching is then performed with the thin Copper allowing for very fine tracks and reduced undercutting.

DPC Ceramic Substrate is the long-proven standard for power electronic modules in industrial, home-appliances and automotive applications. Unipretec ceramic substrates DPC have an excellent performance/cost efficiency ratio. The great heat conductivity of Al2O3 (25 W/mK) and AlN (175 W/mK) as well as the high heat capacity make the substrate irreplaceable in power electronics. The thick copper foils offer extremely good electrical and thermal conductivity and form an outstanding base for the soldering and wire bonding processes.


 √ High Mechanical Strength
 √ Good Thermal Conductivity
 √ Excellent Electrical Insulation
 √ Outstanding Chemical Stability
 √ Extremely High Service Temperature
 √ Small Thermal Expansion Coefficient




● Properties of Ceramic Substrates

ITEM
UNIT
A960
ALN
Main Content
- Al2O3 > 96%  
AlN > 95%     
Density
g/cm3
> 3.7
> 3.3
Color
- White
Grey
Water Absorption
%
0 0
Warpage
- < 2‰
< 2‰
Standard Surface Roughness (Ra)
um
0.2 - 0.7
0.3 - 0.6
Flexural Strength
Mpa
380 440
Thermal Conductivity (25 °C)
W/m.K
> 25
> 175
Thermal Expansion Coefficient  (25 - 300 °C)
10-6 mm/°C 
6.5 - 7.5
2 - 3
Thermal Expansion Coefficient (300 - 800 °C)
10-6 mm/°C
6.5 - 8.0
2.5 - 3.5
Max. Working Temperature
°C
1,200
1,200
Dielectric Strength
KV/㎜
> 17
> 17
Dielectric Constant
1 MHz
9 - 10
17
Electrical Resistivity (25 °C)
Ω·cm
> 1014
> 1014

∆ The data is offered for reference only, exact data will vary depending on producing method & part configuration.


● Applications of DPC Ceramic Substrates


DPC ceramic substrates are recommended for power electronic modules (e.g. current inverters) using MOSFETs or IGBT semiconductor elements and diodes for widespread application fields in the industrial sector: electric motor drives, e.g. in tooling machines, cranes, textile-processing equipment, automation equipment, etc.

- Pumps
- Welding machines
- Electrical industrial vehicles (e.g. power drives for forklifts)
- Induction heating
- Industrial drives (e.g. escalators, conveyor belts, elevators, robots, and servo drives)
- Uninterruptable power supply to. data centers, hospitals, etc.
- Energy technology (e.g. photovoltaics, wind turbines, and energy distribution)
- White goods (e.g. air conditioners, washing machines, refrigerators, and warm water pumps)
- Automotive and traction

As high-performance circuit carriers for power electronic applications:

In such groups as power steering, start-stop systems, air conditioning compressors, water pumps, oil pumps, brakes, etc; Converters for hybrid or electrical power train; Battery chargers; Inductive charging systems; DC-DC converters; Rail vehicles such as locomotives, subway trains, trams and cable cars, etc; Communications.


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